Our SAS 3.0/4.0 series connectors deliver exceptional data transfer speeds of up to 24 Gb/s, ensuring stable and efficient transmission for enterprise storage and server systems. Designed with high reliability and hot-plug capability, each connector undergoes strict quality control and automated precision manufacturing. With flexible customization options and strong R&D support, our SAS connectors are ideal for both board-to-board and wire-to-board applications in enterprise storage systems, servers, and data centers requiring consistent, high-speed performance. ShuangYi Precision — Powering Smarter Connections.
ShuangYi Precision — Powering Smarter Connections.
Why Choose Us:
• Free samples available for quality evaluation.
• Support for both OEM & ODM customization.
• Trade Terms: EXW, FOB, CIF, CPT, etc.
Notice: The displayed price is only for reference. Contact us now for the best offer and detailed quotation!
This SAS 29-Pin Female Connector features a hybrid structure with 15-pin DIP through-hole terminals and 7-pin SMT pads, making it suitable for both high-strength PCB attachment and fine-pitch signal transmission.
The connector uses ≥30u" gold-plated contact terminals with ≥50u" nickel underplating, ensuring excellent conductivity, corrosion resistance, and long-term durability in high-speed SAS signal environments.
The housing and cap parts are made from high-temperature UL94-V0 LCP, providing superior dimensional stability during PCB reflow or hand soldering. With compliance to RoHS 2.0 + HF + REACH, this product is ideal for global electronics manufacturing.
Its mechanical robustness, low contact resistance, and hybrid mounting configuration make it an excellent choice for servers, storage devices, industrial control equipment, automotive electronics, and high-speed PCB designs.
| Product Type |
SAS 29-Pin Female Connector (Hybrid: 15P DIP + 7P SMT) |
| Structure |
15 Pin DIP Through-Hole + 7 Pin SMT Surface Mount |
| Housing Material |
LCP, Glass-Fiber Reinforced, Black, UL94-V0 |
| Terminal Material |
Phosphor Bronze C5191-H, t = 0.25mm |
| PEG/Bracket Material |
Brass C2680-H, Ni ≥ 50u" + Sn ≥ 40u" |
| Plating – Nickel |
≥ 50u" Ni underplating |
| Plating – Gold (Contact Area) |
≥ 30u" Gold |
| Plating – Tin (Solder Area) |
≥ 80u" Tin |
| Operating Temperature |
–20°C to +85°C |
| Rated Current / Voltage |
1.5A @ 40VAC |
| Contact Resistance |
≤ 30mΩ |
| Insulation Resistance |
≥ 1000MΩ |
| Withstand Voltage |
500VAC / 1 minute |
| Insertion Force |
Backplane ≤25N; Cable ≤50N |
| Unmating Force |
Backplane ≥5N; Cable ≥20N |
| Durability (Board Side) |
500 cycles |
| Durability (Cable Side) |
25 cycles |
| Salt Spray Test |
48 hours (Gold-Plated Area) |
| Environmental Compliance |
HF + RoHS 2.0 + REACH |
| Pitch |
1.27mm main pitch |
| Key Notes |
Inspection dimensions marked by sequence numbers |
| PCB Mounting Combination |
SMT 7P pads + DIP 15P through-holes |
Key Features
- Hybrid 15P DIP + 7P SMT design for optimized mechanical strength and electrical performance
- ≥30u" Gold-plated contact area ensuring stable high-speed signal transmission
- ≥80u" tin-plated solder areas for secure PCB soldering
- High-temperature UL94-V0 LCP housing, suitable for industrial and automotive applications
- Low contact resistance (≤30mΩ) and high insulation resistance (≥1000MΩ)
- Durable mechanical structure with 500 cycles (board) and 25 cycles (cable)
- Compliant with RoHS 2.0, Halogen-Free & REACH
- Fine pitch of 1.27mm supporting dense PCB designs
- Suitable for customization: pin count, plating thickness, mounting type, and application-specific features
⚙️ Applications
1. Server & Storage Devices
SAS HDD/SSD modules
RAID controller boards
Server backplanes
High-speed data transmission lines
2. Communication Equipment
Network routers and switches
Optical-electrical conversion modules
Edge computing devices
3. Automotive Electronics
ADAS data modules
In-vehicle storage interfaces
ECU signal connectors
4. Industrial Control Systems
PLC controllers
Industrial computers
Data acquisition boards
5. PCB & High-Speed Signal Designs
Multi-board connectivity
Fine-pitch high-density boards
High-speed signal routing applications
⚠️ Notes
- Ensure DIP through-hole pads and SMT pad patterns follow the recommended PCB layout.
- Use proper soldering temperatures to avoid LCP housing deformation.
- Avoid contamination of gold-plated terminals to maintain signal quality.
- Maintain ESD protection during handling and assembly.
- DIP pins must be fully inserted into PCB holes before soldering to avoid skew.
- Avoid mating with oxidized male connectors.
- Store connectors in dry, anti-static packaging.
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